• Sca500 Semiconductor Grade Crystal Ingot Automatic Loading&Unloading Cutting Machine
  • Sca500 Semiconductor Grade Crystal Ingot Automatic Loading&Unloading Cutting Machine
  • Sca500 Semiconductor Grade Crystal Ingot Automatic Loading&Unloading Cutting Machine
  • Sca500 Semiconductor Grade Crystal Ingot Automatic Loading&Unloading Cutting Machine
  • Sca500 Semiconductor Grade Crystal Ingot Automatic Loading&Unloading Cutting Machine
  • Sca500 Semiconductor Grade Crystal Ingot Automatic Loading&Unloading Cutting Machine

Sca500 Semiconductor Grade Crystal Ingot Automatic Loading&Unloading Cutting Machine

Service après-vente: Free Lifetime Technical Consulting Services
Garantie: 1 an
Paquet de Transport: FCL
Spécifications: L8600mm W2860mm H3800mm
Marque Déposée: Skywiretech
Origine: Chine

Contacter le Fournisseur

Fabricant/Usine, Société Commerciale
Membre d'Or Depuis 2023

Fournisseurs avec des licences commerciales vérifiées

Fujian, Chine
  • Aperçu
  • Product Parameters
  • About Us
Aperçu

Info de Base.

N° de Modèle.
SCA500
Code SH
8486103000
Capacité de Production
1000/Year

Description de Produit

Product Parameters

NO. Item Parameter
1 Processing Capacity
1.1 Ingot length (mm) 500~3000mm
1.2 Ingot diameter (mm) 8-12", max. 350mm (6" requires additional tooling)
1.3 Segment length (mm) 50-700mm(cutting remaining material length 300mm)
1.4 Number of simultaneous cuts at one time 2 cuts
2 Processing Quality
2.1 Processable raw length (mm) 500-3000mm
2.2 Cut-off length deviation (mm) ±0.5mm
2.3 Sample thickness deviation (mm) ±0.2mm
2.4 Thickness difference between the same sample (mm) 8-inch:0.15mm
12-inch:0.25mm
2.5 Surface roughness Within 5um Ra
2.6 Chipping rate (chipping over 1.5mm) Less than 5% (normal chipping rate of head and tail material ≤ 25%)
3 Efficiency and Capacity
3.1 Average cutting speed 10-25mm/min
3.2 Average cutting time 12-inch raw ingot 12-25min (pure cutting time for a single cutter)
4 Consumables Specification
4.1 Wire Tension 0-100N
4.2 Wire Diameter 0.5mm
4.4 Wire Seam Width 0.55mm
4.5 Average Lifetime 8-inch ≥ 180 cuts, 12-inch ≥ 80 cuts
4.6 Wire Length 2960mm
5 Power consumption
5.1 Total power 22.7kw
5.2 Electricity consumption(KW³/H) 13.62
5.3 Power supply 3-phase,5-wire,380V
5.4 Water inlet pressure 0.2-0.4Mpa
5.5 Water consumption(m³/h) 1.2-2.4
5.6 Air inlet pressure(Mpa 0.5-0.7Mpa
5.7 Air consumption(m³/h)  6
5.8 Static load(KN/SQM) 14.3
6 Equipment Specifications
6.1 Equipment size(mm) 8600×2860×3800(mm)
6.2 Body shipping size(L*W*H) 6000×2860×3350(mm)
6.3 Equipment weight (T) 23T

About Us

Sca500 Semiconductor Grade Crystal Ingot Automatic Loading&Unloading Cutting MachineSca500 Semiconductor Grade Crystal Ingot Automatic Loading&Unloading Cutting MachineSca500 Semiconductor Grade Crystal Ingot Automatic Loading&Unloading Cutting MachineSca500 Semiconductor Grade Crystal Ingot Automatic Loading&Unloading Cutting MachineSca500 Semiconductor Grade Crystal Ingot Automatic Loading&Unloading Cutting Machine

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