Type: | Circuit Imprimé Rigide |
---|---|
Diélectrique: | FR-4 |
Matériel: | Fiber de Verre Époxy |
Demande: | Electronics |
Flame Retardant Propriétés: | V0 |
Rigide mécanique: | Rigide |
Fournisseurs avec des licences commerciales vérifiées
Item |
Capabilities |
|
Number of Layers |
Double Side |
|
Material |
FR - 4, CEM - 3, HighTg, Aluminum, Halogen Free |
|
PCB Thickness |
Min.thickness |
0.2mm (8mil) |
Max.thickness |
3.2mm (128mil) |
|
Surface finished |
Gold Plating |
|
Immersion Gold (Silver) |
||
HAL Lead Free |
||
Hot Air Solder Leveling (HASL) |
||
Entek Coating (OSP) |
||
Solder Mask |
Green, White, Black, Yellow, Red, Blue |
|
Other printing |
Gold Finger |
|
Carbon Print, Peelable Mask |
||
Solder Mask Plugged Hole |
||
Copper thickness |
1/2 oz (18 μm) - 4 oz (140 μm) |
|
Min. Finished Hole Size |
0.3mm (12mil) |
|
Hole Size Tolerance (PTH) |
+/-0.076mm (3 mil) |
|
Hole Size Tolerance (NPTH) |
+/- 0.05mm (2 mil) |
|
Min. Line Width and Spacing |
0.10mm (4 mil) |
|
Min. Solder Mask Clearance |
0.076mm (3 mil) |
|
Min. Annular Ring |
0.1mm (4mil) |
|
Profile and V - Cut |
CNC - Routing, Stamping and Beveling, V - CUT, CNC |
|
Special Process |
Micro - section, Chamfer for Gold Finger |
Fournisseurs avec des licences commerciales vérifiées