Xiamen BOLION Workshop Capability |

Material Cutting |

Content | 
Normal | 
Special |

Max dimension of material cutting | 
250MM× 450MM | 
250MM× 10000MM |

Min dimension of material cutting | 
250MM× 100MM | 
 |

Auto-machine cutting tolerance | 
± 1MM | 
 |

Manually cutting tolerance | 
± 2MM | 
 |

Mechanical Drilling |

Content | 
Normal | 
Special |

Min drill Dia. | 
Dia. 0.20MM | 
Dia. 0.15MM |

Max drill Dia. | 
Dia. 6.35MM | 
 |

Min drill space | 
0.15MM | 
0.125MM |

Drill hole Dia. tolerance | 
± 0.05 MM | 
 |

Laser Drilling |

Content | 
Normal | 
Special |

Min drill Dia. | 
Dia. 0.15MM | 
Dia. 0.1MM |

Max drill Dia. | 
Dia. 6.35MM | 
 |

Min drill space | 
0.1MM | 
 |

Drill hole Dia. tolerance | 
± 0.02 MM | 
 |

Copper plating |

Content | 
Normal | 
Special |

Copper plating capacity(thickness of hole plating) | 
8-15um; 20-30 um (± 5um' s distribution) | 
30-70 um |

Max PNL dimension for PTH | 
250MM× 350MM | 
250MM× 2000MM |

Aspect ratio (= board thickness / min via diameter) | 
2 max for 0.10 mm vias | 
3 max for 0.10 mm vias |

4 max for 0.15 mm vias | 
5 max for 0.15 mm vias |

6 max for 0.20 mm vias | 
7 max for 0.20 mm vias |

8 max for 0.25 mm vias | 
9 max for 0.25 mm vias |

Blue photosensitive etching-resist ink (Silkscreen) |

Content | 
Normal | 
Special |

Max PNL dimension of screen printer | 
300× 450MM | 
250MM× 2000MM |

Thickness of photo image ink | 
15-20um | 
10-40um |

Dry film |

Content | 
Normal | 
Special |

Max production dimension of dry film | 
250MM× 350MM | 
330MM× ∞ MM |

Thickness of dry film | 
30um | 
20um; 40um; 50um |

Exposure |

Content | 
Normal | 
Special |

Space between pads and line (panel plating) | 
≥ 0.15MM | 
≥ 0.10MM |

Space between pads and line (via pads pattern plating) | 
≥ 0.30MM | 
≥ 0.20MM |

Layer to layer misregistration tollerance | 
0.2MM | 
0.10MM |

Min size of square solder mask opening | 
0.40MM× 0.40MM | 
 |

Min circular solder mask open size | 
Dia. 0.35MM | 
 |

Min width of solder mask | 
0.15MM | 
0.10MM |

Solder mask bridge aspect ratio (=length/width) | 
10 max for 0.10 mm width | 
15 max for 0.10 mm width |

15 max for 0.15 mm width | 
20 max for 0.15 mm width |

20 max for 0.20 mm width | 
25 max for 0.20 mm width |

Space between solder mask open and trace | 
0.1mm | 
0.05mm |

Max PNL size on exposure machine | 
250MM× 350MM | 
600MM× 750MM; 600MM× 10000MM (Space > 0.3MM) |

Min dimension of non-PTH circular pad | 
Dia. 0.3MM | 
Dia. 0.2MM |

Min anular ring width of PTH pad | 
0.125MM | 
0.10MM |

Etching |

Content | 
Common | 
Special |

Max production size of etching | 
250MM× 350MM | 
500MM× ∞ |

Min trace & space width | 
0.06± 0.01 MM (copper thickness: 12 um) | 
0.05± 0.01 MM (copper thickness: 12 um) |

0.075± 0.015 MM (copper thickness: 18 um) | 
0.065± 0.015 MM (copper thickness: 18 um) |

0.1± 0.02 MM (copper thickness: 25~35 um) | 
0.085± 0.02 MM (copper thickness: 25~35 um) |

0.1± 0.03 MM (copper thickness: 35~45 um) | 
0.085± 0.02 MM (copper thickness: 25~35 um) |

Coverlay alignment |

Content | 
Normal | 
Special |

Coverlay alignment tolerance | 
± 0.30 MM (manually operating) | 
± 0.20 MM |

± 0.20 MM (fixturally operating) | 
± 0.0.15 MM |

Min space between opening and pad | 
0.2MM | 
0.15MM |

Overlap of coverlay opening and iland finger or pads | 
0.5 MM | 
0.3 MM for Circular pads |

Lamination |

Content | 
Normal | 
Special |

PNL size on quick press | 
250MM× 400 MM | 
340MM× 5000MM |

PNL size on traditional vacuum press | 
630× 550MM | 
 |

Adhesive squeeze when laminating | 
Quick press: 6± 2mil | 
 |

Vacuum press: 3± 1mil | 
 |

Silkscreen |

Content | 
Normal | 
Special |

Legend ink color | 
white, black | 
Per request |

solder mask color | 
Yellow, green, amber | 
Per request |

silver/carbon pastes color | 
silver pastes: silver; carbon pastes: black | 
 |

Working size of silkscreen table | 
350 MM× 700 MM | 
250MM× 2000MM |

Min character width | 
0.125 MM | 
0.10 MM |

Min character height | 
0.80 MM | 
0.70 MM |

Space between character and pad opening | 
0.5 MM | 
0.3 MM |

Silkscreen alignment tolerance | 
± 0.30MM | 
± 0.20 MM |

Silkscreen silver pastes tolerance | 
± 0.50MM | 
± 0.40 MM |

Silkscreen solder mask tolerance | 
± 0.50MM | 
± 0.30 MM |

Min distance between silkscreen to outline | 
0.3 MM | 
 |

Min distance between silkscreen to NPTH | 
0.3 MM | 
 |

Printed ink thickness | 
Legend character: 8-15 um | 
 |

Solder mask: 15-25 um | 
 |

Silver ink: 10~25 um | 
 |

Carbon ink: 10-20um | 
 |

Carbon ink: 10-20um | 
 |

Final finshing |

Content | 
Normal coating thickness | 
 Normal PNL size |

Plating nickel gold (In house) | 
Ni: 2-9um; Au: 0.03-0.09um | 
300mm× 400 MM |

Plating hard gold (In house) | 
Ni: 2-9um; Au: 0.1-1.0um | 
300mm× 400 MM |

Plating soft gold (In house) | 
Ni: 2-9um; Au: 0.03-0.09um | 
300mm× 400 MM |

Plating pure tin (In house) | 
2.0-8.0um | 
300mm× 400 MM |

Immersion Tin (In house) | 
0.3-0.6um | 
300mm× 400 MM |

OSP (In house) | 
N/A | 
300mm× 400 MM |

ENIG (Hard Nickel) (In house) | 
Ni: 2-6um; Au: 0.03-0.10um | 
300mm× 400 MM |

ENIG (Soft Nickel) (In house) | 
Ni: 2-6um; Au: 0.03-0.10um | 
300mm× 400 MM |

ENEPIG (Hard Nickel) (In house) | 
Ni: 2-6um; Au: 0.03-0.10um | 
300mm× 400 MM |

HASL (Outsource) | 
Cover the pads with min thickness 1~2 um | 
300mm× 400 MM |

Immersion silver (Outsource) | 
Per standand creteria | 
300mm× 400 MM |

Electrical test (Flying probe tester for sample) |

Content | 
Normal | 
Special |

Max test points qty | 
4096 | 
 |

Min probe | 
0.25MM | 
0.15MM |

Max probe | 
1.70MM | 
 |

Safe distance between test probes | 
0.20MM | 
 |

Stiffener, PSA alignment tolerance |

Content | 
Normal | 
Special |

Min safe space between alignments and pads opening | 
± 0.50 MM | 
± 0.30 MM |

Tolerance without hole-centered alignments | 
± 0.40 MM | 
± 0.40 MM |

Tolerance with hole-centered alignments | 
± 0.2 MM | 
 |

Min strip width of PSA | 
2MM | 
1.0 MM |

Min seperate PSA size | 
13× 2.0 MM | 
 |

Die cutting |

Content | 
Normal | 
Special |

Outline manually cutting (Outline length≤ 100MM) | 
± 0.20 MM (Need manually cut guide line) | 
 |

Outline manually cut (Outline length > 100MM) | 
± 2 ‰ | 
 |

Outline soft tooling cut (Outline length≤ 100MM) | 
± 0.20 MM | 
 |

Outline soft tooling cut (Outline length > 100MM) | 
 ± 2‰ | 
 |

Outline etching die cut (Outline length≤ 100MM) | 
± 0.10 MM | 
 |

Outline etching die cut (Outline length > 100MM) | 
± 1.5‰ | 
 |

Outline normal hard tooling cut (L< 100MM) | 
± 0.10 MM | 
 |

Outline normal hard tooling cut (100≤ L< 150MM) | 
± 0.15 MM | 
 |

Outline normal hard toolingcut (L≥ 150MM) | 
± 1.5‰ | 
± 1.3‰ |

Outline precise hard tooling cut (L< 100MM) | 
± 0.05 MM | 
 |

Outline precise hard tooling cut (100≤ L< 150MM) | 
± 0.1 MM | 
 |

Outline precise hard toolingcut (L≥ 150MM) | 
± 1.2‰ | 
± 1.0‰ |

Outline segmented cut | 
± 1.5‰ (soft tooling) | 
 |

Min punching hole Dia. and tolerance | 
Dia. 0.60 ± 0.05 MM | 
 |

Tolerance for hole to board edge | 
1.0 MM(normal soft die cut tooling) | 
0.50 MM(Etching die cut tooling, normal hard tooling) |

Tolerance for trace center to board edge | 
0.10 MM | 
0.08 MM(precise hard tooling) |

Package | 
 | 
 |

Content | 
Normal | 
Special |

Tray | 
Per product size | 
 |

Low viscosity PET layer | 
300× 210MM | 
 |

Ziplock bag | 
Per product size | 
 |

Vacuum sealing package | 
16cmx23cm, 20cmx34cm, | 
28cmx36cm, 30cmx50cm |