Domestic Eutectic Machine with Multiple Workbenches and Fast Temperature Control

• Condition: Nouveau
• La vitesse: Haute vitesse
• Précision: Haute précision
• certificat: ISO, CE
• garantie: 12 mois
• automatique année: Automatique
• N° de Modèle.: EH9721
• Type: Haut débit Chip Mounter
• applications de l′équipement: coc, rafle, boîte or, vache, cos
• poids: 2200kg
• buse: 12 buses par tête, avec changement d′outil dynamique
• table de travail: 2
• table de transfert: jusqu′à 8 tables de travail (par machine)
• plage de température: jusqu′à 500 °c (maximum)
• taux d′augmentation de la température: 50 °c/s (maximum)
• Paquet de Transport: Wooden Crates and Vacuum Wooden
• Spécifications: 1900mm*1100mm*1800mm
• Marque Déposée: Suzhou Bozhon Semiconductor Co
• Origine: China

Description de Produit

 

Product Description

The EF8621 provides flexible and diverse packaging capabilities for advanced packaging.

Detailed Photos

1. High Precision: ±3µm@3σ, giving customers leading product yields
2. High Efficiency: Dynamic tool changing, dual intermediate shaft, high-efficiency soldering station (heating rate of 80ºC/s, cooling time from 340ºC to 200ºC in 5 seconds), providing over 20% output improvement under specific conditions
3. High Flexibility: Multiple suction nozzles for automatic replacement, multiple intermediate stations for free switching, and various feeding methods for flexible selection, supporting up to 8 products for inline production
4. Easy to Expand: Proprietary customer programming interface (BOS), customizable development, and optional functional modules.

 

Product Parameters

 

Product model		EF8621
Placement accuracy		±3µm@3σ
Placement angle		±0.3°
Placement process		Eutectic, adhesive dipping
Equipment application		COC,COB,Gold Box,COW,COS
Efficiency		15~25 seconds/chip (eutectic)
		5~7 seconds/chip (adhesive dipping)
Placement module	Nozzle	12 nozzles per head, with dynamic toolchange
	Force control.	(10~50g)±2g,(50~300g)±3%
Transfer module.	Nozzle	2 nozzles per head, with dynamic toolchange
	Force control.	(10~50g)±2g,(50~300g)±3%
Eutectic module	Working table	2
	Transfer table	Up to 8 working tables (per machine)
	Heating method	Pulse heating
	Temperaturerange.	500°C(highest)
	Temperaturerising rate	50°C/S(maximum)
Feeding mode	Wafer	6-inch, up to 2 wafers supported
	Waffle Pack Gel-Pak	2-inch, up to 2supported
Dimensions (length x width x height)		1900mm×1100mm×1800mm
Weight		2200kg (max)
Compressed air		0.4~0.7MPa
Nitrogen gas		0.4~0.7MPa
Environmental temperature		23±2°C

 

After Sales Service

Company Profile

Suzhou BOZHON Semiconductor Co., Ltd. was established in 2022 and is a global semiconductor equipment R&D and manufacturing company. With over 20 years of technical expertise in the semiconductor industry, the company provides leading and stable advanced process and inspection equipment to its customers. Suzhou BOZHON Semiconductor is committed to becoming a leader in the Chinese semiconductor industry by developing and innovating products using micrometer, sub-micrometer, and nanometer-level technologies. The company aims to promote the advancement of semiconductor processes and industry upgrades, and continuously provide cutting-edge products to the industry.

 

FAQ

1.Where does Bozhon Semiconductor come from?
Bozhon Semiconductor is from Suzhou, China and is part of the Bozhon Precision Industry Group.

2.Are the products self-branded or resold?
All products are self-developed, and many technologies have been awarded national patents.

3.What is the minimum order quantity for the product?
1 set.

4.How long does it take to ship an order?
Within 100 days of signing the contract

5.Is the price on the product page the final price?
No, the final price is based on the specific product model, subject to the actual offer.